Company Name: Intel Corporation
Job Description: Graduate Manufacturing Engineering Intern
Job Number: 705742
Description
Job Description: Come intern with Intel's Mobile Communications Group.
Responsibilities may be quite diverse in a technical nature and will vary
significantly depending on the unique needs of the role, U.S. experience and
education requirements. Job assignments may be for the summer or for short
periods throughout the school year.
The selected candidate will be part of the Manufacturing Operations team
in the Mobile and Communications Group, located in Oregon. In this position,
the Manufacturing Engineer (ME) will have broad-based responsibility for
enabling ODM and/or Contract Manufacture capability and readiness to produce
Smartphone or Tablet based products. The ME will work with responsible design,
engineering, and TD groups on ensuring the appropriate manufacturing collateral
is developed and delivered. They will own Mfg Risk assessments of the CM/ODM or
Technology Development sites and developing and executing a risk mitigation
strategy to ensure successful product launch. The ME will own defining &
driving the manufacturing flow requirements including packaging, manual
assembly, inspection guides & requirements.
This ME will also drive collaborative design reviews of the card and
assemblies during the design cycle to ensure product manufacturability, yields,
cost effectiveness, and efficiency through the use of DFx rule analysis and
other related tools. The ME will establish the appropriate DFx rules for this
market segment by validating current DFx rules against the requirements and
capabilities in this market segment and making the appropriate modifications or
tradeoffs as necessary.
The ideal candidate should exhibit the following behavioral traits:
I. Creative & effective problem solving skills
II. Effective organizational skills to track multiple issues &
activities across multiple sites
Qualifications
You must possess the below minimum qualifications to be initially
considered for this position. Preferred qualifications are in addition to the
minimum requirements and are considered a plus factor in identifying top
candidates. Experience listed below would be obtained through a combination of
your school work/classes/research and/or relevant previous job and/or
internship experiences.
Minimum Qualifications:
I. Must be pursuing an MS or PhD in Electrical Engineering, Computer
Engineering or Computer Science
Preferred Qualifications:
I. Minimum of 3 months experience with PCB design, layout, and critical to
manufacturing parameters, circuit board fabrication, design and/or assembly
techniques
II. Minimum of 3 months experience with SMT, Wave, and Manual assembly
processes
III. Minimum of 3 months experience with Design for manufacturing techniques
IV. Minimum of 3 months experience with Industry standard workmanship and
repair standards - IPC series
Job Category: Manufacturing
Primary Location: USA-Oregon, Hillsboro
Full/Part Time: Full Time
Job Type: Student/Intern
Regular/Temporary: Temporary
Apply Before: Jun 29, 2013
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